text: abstract—we present an extended analytic formula for the
  calculation of the temperature profile along a bondwire embedded
  in a package. the resulting closed formula is built by coupling
  the heat transfer equations of the bondwire and the surrounding
  moulding compound by means of auxiliary variables that stem
  from an ad-hoc linearisation and mediate the wire-mould thermal
  interaction. the model, which corrects typical simplifications in
  previously introduced analytic models, is also optimised against
  carefully taken experimental samples representing fusing events
  of bondwires within real packages.
  index terms—bondwires, heat equation, mould compound,
  thermal conduction, thermal radiation, heat kernel, green’s
  function.